Untitled Document
Date
Content
Nov. 1997
Automatic Plating Line of Ni, Au in Myeongsin Co., Ltd.
July 1998
Automatic Plating Line of Cu, Ni, Sn, Pb in Jeongwoo Cheomical Co., Ltd.
Sept. 1998
Automatic Plating Line of Ni, Au in Sangjin Co., Ltd.
Dec. 1998
MLB Press System(Unit 1) of Daewon Electronics Co., Ltd.
Apr. 1999
Moved Ni, Sn Plating Line and Automted Lind in Samhwa Condensor Co., Ltd.
Oct. 1999
MLB Press Data Acquisition of Multi Korea Co., Ltd.
Dec. 1999
MLB Press System(Unit 2) of Daewon Electronics Co., Ltd.
June 2000
Cu, Ni Automatic Plating Line of Asia Magnet Co., Ltd.
Aug. 2000
Cu, Ni Automatic Plating Line of Sinjin Co., Ltd.
Oct. 2000
Cu, Ni, Au Automatic Plating Line of Myeongjin Chemical Co., Ltd.
Dec. 2000
Black Oxide Automatic Plating Line of Daebang Co., Ltd.
Feb. 2001
Cu, Ni, Au Semi-Automatic Plating Line of Jeongwoo Chemical Co., Ltd.
Feb. 2002
Metaro-Tech Pigmentation Testing Line of Sunchon National University, dept of Material Science and Metallurgical Engineering.
Mar. 2002
Cu,Ni Automatic Plating Line of Hyundai-Metal Co., Ltd.
Apr. 2002
Cu Automatic Plating Line of Uni-Tech Co., Ltd.
Jul. 2002
Cu,Ni,Cr Automatic Plating Line of IL Shin Chemical Co., Ltd.
Aug. 2002
Cu, OXIDE Tank of Samsung SDI Co., Ltd.
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